DIN 60352-2 outlines distinct test sequences to simulate real-world aging. The tests are typically divided into:
As electronics move toward (EVs, e-mobility) and higher temperatures (SiC, GaN devices), press-in offers a solder-free path. New developments include: din 60352-2
A mismatch between pin and hole can lead to: DIN 60352-2 outlines distinct test sequences to simulate